Intel Demonstrates First Working 32nm-based processor

intel 32nm processor Disclosure

10th, Feb 2009 San Fran­cis­co, Intel corp, World’s largest semi­con­duc­tor com­pa­ny demon­strat­ed the first work­ing 32nm proces­sor. Intel Cor­po­ra­tion dis­cussed new mile­stones for 32nm man­u­fac­tur­ing and progress toward future products.

Intel 32nm Processor

Work­ing intel 32nm processor

Sum­ma­ry of the Roadmap at the brief­ing in San Francisco:

First-ever demon­stra­tion of a work­ing 32nm-based microprocessor:

  • Intel is demon­strat­ing the first 32nm work­ing micro­proces­sor in both mobile and desk­top systems.
  • Great 32nm process and prod­uct health are enabling Intel to accel­er­ate 32nm prod­uct ramp 
    • West­mere mobile and desk­top proces­sor pro­duc­tion in the fourth quar­ter of 2009
    • 32nm enables increased per­for­mance and pow­er flexibility
  • Intel proces­sors based on West­mere will ramp into mobile, desk­top, and serv­er seg­ments over time, as the 32nm process ramps

For client, West­mere brings Nehalem through Intel’s main­stream proces­sor prod­uct line

  • Increased per­for­mance, small­er proces­sor core size
  • New mul­ti-chip pack­age with graph­ics inte­grat­ed in the processor
  • Repar­ti­tioned sys­tem archi­tec­ture, sim­pli­fied motherboards
  • Vol­ume ramp; expect 32nm in serv­er mar­ket in 2010

West­mere key features

  • Intel? Tur­bo Boost technology
  • Intel? Hyper-Thread­ing tech­nol­o­gy (2 Cores, 4 threads)
  • Inte­grat­ed graph­ics, discrete/​switchable graph­ics support
  • 4MB cache, Inte­grat­ed Mem­o­ry Con­troller (IMC) – 2ch DDR3
  • AES Instruc­tions

The 32nm process with sec­ond-gen­er­a­tion high‑k + met­al gate tran­sis­tor allows to deliv­er new gen­er­a­tions of advanced process tech­nol­o­gy on a 2‑year cadence. Intel has devel­oped a 32nm log­ic tech­nol­o­gy with indus­try-lead­ing features:

  • Sec­ond-gen­er­a­tion high‑k + met­al gate transistors
  • 32nm marks the first time Intel uses immer­sion lith­o­g­ra­phy on crit­i­cal layers
  • 9 cop­per + low‑k inter­con­nect layers
  • About 70 per­cent dimen­sion scal­ing from 45nm generation
  • Pb- and halo­gen-free packages

For more infor­ma­tion refer intel web­site